|Korea Advanced Institute sued on FinFET infringement|
The state-run research institute confirmed that its intellectually property management arm, KAIST IP, has sued Samsung Electronics, Qualcomm and Global Foundries in a Texas court over the use of KAIST's FinFET technology without permission.
|Intel plans to put latest NAND technology into SSD on 2017|
Intel is planning to begin mass producing new 3D NAND flash products in 2017 to compete for datacenter, professional, consumer and embedded markets. In addition to developing 3D NAND flash, Intel has also been pushing its Optane SSD using 3D XPoint technology.
|Long time CFO retired from Texas Instruments|
Texas Instruments said it will name corporate controller, Rafael Lizardi, as its new chief financial officer in February, replacing 32-year veteran Kevin March, who has been CFO for thirteen years, and is retiring at age 58.
|NAND sales jumped in Q3|
Output value for the global NAND flash industry increased 19.6% sequentially to US$10.23 billion in the third quarter of 2016, according to DRAMeXchange.
|NoteBook computers are switching over to SSD|
The number of notebooks built to use SSDs, which are based on NAND flash, exceeded analyst expectations this quarter, and the industry is on pace to surpass the 50% adoption rate in the 2017 to 2018 timeframe, according to a report from DRAMeXchange.
|ChipMos replaced sell out plan to Tsinghua with joint venture|
After the deal closes, ChipMOS BVI will own 45.02% of ChipMOS Shanghai, while Tsinghua Unigroup, through its subsidiary Tibet Unigroup Guowei Investment, will own 48%. The remaining 6.98% will be held by other strategic investors, including a limited partnership owned by ChipMOS Shanghai's employees.
|SSD prices increased|
Set against the third quarter, the average contract prices in the PC-OEM market for mainstream client-grade SSDs using MLC NAND Flash are estimated to rise by 6~10%.
|Murata offer 60A power converter for FPGA systems|
The OKDL-T/60 power module is intended to power FPGA and processor applications. The module is specified to operate over a Vin range of 4.5V to 14 VDC, and provides a user adjustable output in the range of 0.6 VDC to 1.8 VDC.
|Robust quarter for Taiwan fabs|
Combined revenues of Taiwan's top-3 foundries - Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) - are estimated to be US$9.56 billion in the fourth quarter of 2016, up 28.6% on year.
|TSMC to offer 12nm half note process|
the half-node process is a competitive response to the 14nm processes of Samsung and GloFo. The 12nm process will have better leakage and be lower cost than 16nm.
|Intel Core i7 to go into Delphi self-driving systems|
Intel announced this month that it would invest $250 million in start-ups working on automated-driving technologies. In July it formed a partnership with Mobileye and the German automaker BMW to provide chips for a self-driving car that BMW intends to begin producing by 2021.