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Saturday, August 19, 2017
Industry News
Qualcomm responded to SEC probe on dispute with Apple 8/16/2017
Apple and Qualcomm are locked in a sprawling legal battle, with the iPad maker objecting to Qualcomm's business model of requiring customers to sign patent license agreements before buying chips.
California court grant injunctions for WD to access Toshiba data base 8/16/2017
Tosiba had previously witheld early production parts of the new 96-layer NAND flash memories from WD.
ChipMOS finds market on display driver packaging 8/15/2017
Customers are benefiting from a recovery in demand for small displays used in smartphones, as most handset vendors have completed new designs by adding extra features, such as slim-barrel screens, or OLED displays.
China appoints provincial government to watch over Apple cloud center 8/15/2017
China has started to police the Internet more closely and introduced a new cyber security law on June 1 that imposes tougher controls over data than in Europe and the United States, including mandating that companies store all data within China and pass security reviews.
DRAM Q3 contract prices up 8/15/2017
Contract prices for PC DRAM modules rose nearly 40% sequentially to US$24 in the first quarter of 2017, and grew another 10% to US$27 in the second quarter. Prices for July alone increased 4.6% on month.
Toshiba's preferred bidder might have on time cash problem 8/15/2017
Toshiba Corp.’s talks to sell its chips business to a consortium led by Bain Capital hit an impasse over the timing of payments for the business and governance issues, casting doubt on the company’s ability to complete a deal quickly.
Using NFC on your phone as smartkey for your car 8/14/2017
To prevent the risk of smartkey hacking, South Korean automotive supplier Hyundai Mobis has developed an integrated smartkey system where a user installs an app on an NFC-supported smartphone and utilises it as a smartkey for their vehicle.
ChipMos hit temporal weakness on backend order 8/14/2017
Clients scaled back orders due to flagging smartphone demand in China and fewer orders from a major commodity DRAM client.
TSMC to spend $3.15 billion on new capacity 8/14/2017
TSMC recently decided to make a new capital investment of US$3.153 billion in order to increase its production capacity. US$528 million is scheduled to be spent on the construction of new manufacturing facilities and the rest goes to facility expansion and renovation.
Toshiba reconsidering Foxconn and WD 8/14/2017
On Thursday, Toshiba Chief Executive Satoshi Tsunakawa revised description, saying: "In addition to the (Japanese) consortium, we are also in talks with Western Digital and Hon Hai" Precision Industry Co.,
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