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Saturday, April 29, 2017
Industry News
Market demand helped advance China fabs to 28nm 4/12/2017
Semiconductor Manufacturing International Corporation (SMIC) and Shanghai Huali Microelectronics Corporation (HMLC) are the two leaders among Chinese foundries in the development of the 28nm processing. The existence of foreign-owned fabs in China will pressure these two domestic manufacturers to further accelerate their timetables for this technology.
Samsung Galaxy S8 is projected to be a hot seller 4/12/2017
Number of pre-orders for the Samsung Galaxy S8 has reached 143% in comparison to the same event for the Galaxy S7 it held last year. In South Korea, approximately 550,000 consumers chose the product during pre-sale for two days.
China Tsinghua Unigroup breaks ground for memory plant 4/12/2017
This Nanjing plant will be engaged in the manufacture of 3D NAND flash and DRAM chips, according media reports from China.
AMD buys Nitro for AR/VR technology 4/12/2017
Nitero's technology for wireless virtual reality headsets will help AMD broaden its portfolio to create more immersive computing experiences.
Samsung memory business carrying the company through polictical troublesome period 4/11/2017
The South Korean technology group has turned in its second-highest quarterly operating profit on the back of hot-selling memory chips.
Up start company said it has IP to improve memory sfficiency and performance 4/11/2017
Performance-IP recently introduced its Memory Request Optimizer, a block of IP able to improve memory efficiency and increase the performance of a system on chip (SoC) by reducing latency between the memory subsystem and the SoC client.
Phison to bid on Toshiba chip unit 4/11/2017
The company might seek to raise NT$5 billion to NT$6 billion via offering 20 million shares via a private placement and aim to raise another NT$10 billion to NT$20 billion by selling corporate bonds.
SK Hynix jumps forward with 72 layers 3D NAND 4/11/2017
SK Hynix has successfully developed a 72-layer 256 Gigabit TLC 3D NAND flash chip, the company announced. It will allow one chip to hold 32 Gigabytes of memory.
Former Dell/Lenovo veteran to lead Dell EMC Division 4/10/2017
David Schmook, current president of the $38 billion end-user computing business at Dell and former president of Lenovo North America will become president of Dell EMC North America effective May 8.
Intel: New AI chips require new architecture 4/10/2017
The reason why industry needs new architecture for neural networks becomes apparent when you work with GPUs at a low level.
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