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Saturday, April 29, 2017
Industry News
MediaTek strengthens itself by acquiring Airoha Technology 3/31/2017
Airoha is engaged in the design and development of handset PA, RF T/R switches, low-noise amplifiers (LNA), digital TV and set-top box DVB-S/S2 tuners, WiFi transceivers and Bluetooth SoCs.
Toshiba shareholders approved idea to sell chip unit 3/31/2017
Toshiba Corp shareholders agreed to split off its prized NAND flash memory unit on Thursday, paving the way for a sale to raise at least $9 billion to cover U.S. nuclear unit charges.
Bidders are plenty for Toshiba chip business 3/30/2017
Bidders include U.S concern Western Digital, which partners with Toshiba on NAND flash memory production, and South Korean competitor SK Hynix. Other reported suitors include Taiwan's Hon Hai Precision Industry, known as Foxconn, as well as European and U.S. investment funds.
Europe invests in photonic integrated circuits 3/30/2017
“The consortium involved in PIXAPP, has an unmatched record of excellence in delivering many world ‘firsts’ in PICs. We will establish ‘best in class’ PIC packaging technologies that are cost-effective and scalable to high volume manufacture.
Elon Musk to develop brain implants to treat neural disorders 3/30/2017
Musk's proposal wants to build on those existing neural medical treatments as well as one day work on surgeries that could improve cognitive functioning.
Toshiba put its Westinghouse unit in bankrupcy 3/30/2017
Toshiba said in a statement that it filed its U.S. nuclear unit Westinghouse Electric Co. in Chapter 11 petition in the U.S. Bankruptcy Court of New York to stop the flow of massive red ink.
Chunghwa Precision Test Tech wants to expand backend test in Taiwan 3/29/2017
CHPT makes cards that test the quality of wafers, round, silicon discs on which chips are built. Taiwan Semiconductor Manufacturing Co., the world's largest contract chip maker, accounts for close to 50% of its revenue.
Cypress to adjust its memory price upward 3/29/2017
Cypress has informed its customers of new prices for certain flash products including NOR flash, RAM MCP solutions, NAND flash and SLC NAND chips that will become effective from April 25, 2017
Intel to ship SSD with 3D Xpoint on April 3/29/2017
The new SSD does not replace DRAM. For example, if a game requires 8GB of DRAM, you can't use 4GB of DRAM and 16GB of Intel's Optane memory to meet the game's requirement. DRAM continues to be needed for regular PC functions.
China's SMIC offers mature process for IoT applications 3/29/2017
SMIC already offers 55nm process technology for the manufacture of chips for IoT applications. SMIC's 55nm processes for IoT-related devices are avalabile in both low power and storage integration versions, and the portfolio is helping the foundry to grow its business in the IoT field.
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